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Last Build Date: Sun, 24 Sep 2017 21:06:45 -0400

 



EP39-2 Adhesive Aids in Photoelectrochemical Application

Fri, 22 Sep 2017 11:52:10 -0400

Master Bond EP39-2 features excellent clarity and light transmission properties. It offers superior wear and chemical resistance over the wide service temperature range of -60°F to 300°F. These characteristics proved to be especially useful in a research application performed by the University of Hawaii. The epoxy was used in the development and assembly of photoelectrochemical (PEC) systems to produce hydrogen directly from water using sunlight as the energy source. Read...

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One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

Tue, 19 Sep 2017 12:55:54 -0400

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support. “Besides being easy to handle, this system also offers superior resistance to high temperatures, with a glass transition...

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See Glue Dots Hand-Held Applicators, Benchtop Dispensers and Adhesive Products in Action in ...

Sat, 16 Sep 2017 12:02:52 -0400

GERMANTOWN, Wis., (August, 2017) - Glue Dots International is showcasing its adhesives, hand-held applicators and semi-automated benchtop dispensers, which are designed for easy application and convenient storage of Glue Dots® Brand Adhesives, in booth No. S-5931 at PACK EXPO 2017, Sept. 25-27, at the Las Vegas Convention Center in Las Vegas, Nevada. Glue Dots International has been pioneering pressure-sensitive adhesives for numerous markets and industries for more than 20 years, and...

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High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

Sat, 16 Sep 2017 11:58:46 -0400

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and...

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Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals

Fri, 15 Sep 2017 12:19:10 -0400

Master Bond EP62-1 is primarily used as an adhesive, sealant or coating. It has the ability to withstand harsh environmental conditions including exposure to acids, bases and solvents. This two part epoxy features thermal stability with a glass transition temperature exceeding 160-165°C. Read More: http://click.skem1.com/click/ja603-bth3q4-13mg5465/ Dimensionally stable, this two part epoxy has excellent physical strength properties. It has a long pot life and versatile cure...

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CYRO-WELD 5000 Series UV / Visible / LED Curable Multi-Substrate Medical Bonder

Tue, 12 Sep 2017 11:24:48 -0400

Incure Cyro-Weld 5000 series UV / Visible / LED light curing adhesives are medical bonders specially designed for use in medical device manufacturing, such as respiratory face masks and needle-bonding. 5040F (115cP) / 5021F (150cP) / 5422F (300cP) offer users different viscosities without comprising performance to suit specific application needs. Cure on demand and tack-free, they are 100% solids and fluoresces under blacklight to aid in-line and out-going quality inspection. Excellent for...

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Master Bond EP39MAOHT for Large Potting & Encapsulation Applications

Fri, 01 Sep 2017 09:21:35 -0400

EP39MAOHT blends a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This video demonstrates this system’s mixing and flow properties. This room temperature curing system has excellent thermal conductivity and electrical insulation properties. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and bases. Read More: http://click.skem1.com/click/iy8v0-bqa1xb-13mg5468/ For more information,...

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High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications

Tue, 29 Aug 2017 11:16:49 -0400

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated temperatures and low exotherm upon curing.” This system features an excellent die shear...

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Supreme 3HT-80 Epoxy Adhesive can withstand thermal cycling.

Sat, 26 Aug 2017 10:16:09 -0400

Supreme 3HT-80 Epoxy Adhesive is effective in adhering plastics to metals or rubber to metals. The product is cured at temperature 175-180°F in 45-50 minutes. Having low stress properties, product can withstand 1,000 hours of 85°C/85% RH testing and is suitable for electronic and opto-electronic applications.

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Adhesives for Your Specific Needs

Fri, 25 Aug 2017 08:50:17 -0400

EP29LPSPAO-1 Black: Passes NASA Low Outgassing Tests EP29LPSPAO-1 Black is a two component, high performance epoxy system with impressive electrical insulation properties and thermal conductivity of 9-10 BTU•in/ft2 •hr•°F. It is serviceable at temperatures as low as 4K. This adhesive, sealant, coating and encapsulant is also able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). For more information,...

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UV / VISIBLE / LED Curable Multi-Substrate (Plastics) General Bonder

Tue, 22 Aug 2017 09:13:55 -0400

High Clarity, Cures Tack-Free, Medium Viscosity Bonder Incure Uni-Weld 1924 UV / Visible / LED curable adhesive is an acid-free, multi-substrate medium viscosity bonder. High in clarity and cures tack-free, it is an excellent choice for applications requiring good bonding strength of 2,700 to 5,700 PSI on multiple substrates such as metals, glass, plastics, FR4 materials on a single application. Incure 1924 exhibits enhanced excellent moisture and temperature resistance, fluoresces under...

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One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications

Tue, 08 Aug 2017 09:09:08 -0400

Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics. Surfaces primed with X21Med are compatible with a wide variety of adhesives,” said Venkat Nandivada, manager of technical...

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Top Five Thermally Conductive Adhesives

Fri, 04 Aug 2017 12:28:59 -0400

EP36AO: Flexible Epoxy for Potting and Encapsulation Applications B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -100°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers exceptional electrical insulation properties. For more information, request a technical data...

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Newly Developed Products of 2017

Fri, 21 Jul 2017 13:06:35 -0400

EP62-1BF: Low Viscosity Epoxy With Exceptional Chemical Resistance EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to used for potting small components. EP62-1BF is thermally stable and has a glass transition temperature (Tg) of 125-135°C and is serviceable over the wide temperature range of...

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BioCoatâ"¢ Sealant comes with 1.2ml syringe.

Fri, 21 Jul 2017 12:45:14 -0400

BioCoat™ Bioactive Resin Pit and Fissure Sealant offers compressive and shear bond strengths. Providing low polymerization shrinkage, unit is thixotropic which flows freely into tightest pits and fissures. Products’s SmartCap™ technology uses semi-permeable resin microcapsules.

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Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings ...

Tue, 18 Jul 2017 10:49:44 -0400

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support. “Its toughness lessens the chance of stress cracking when thermally cycled and its low exotherm makes it particularly useful for...

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Adhesives for the Medical Industry

Fri, 14 Jul 2017 12:40:03 -0400

For an overview of our most popular medical grade formulations, please browse this easy to read catalog organized by chemistry, key properties and curing schedules. From the prototype stage through the assembly process, each compound in this 24 page catalog is designed to satisfy the requirements of medical device manufacturing companies. These products meet either USP Class VI or ISO 10993-5 cytotoxicity specifications, while select biocompatible systems meet both industry standards. Read...

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Ply-Guard EP - 100% Solids Epoxy Resin System

Thu, 13 Jul 2017 14:39:44 -0400

Polyset, a leading manufacturer of polymer materials, is proud to offer a low viscosity, 100% solids, self-leveling epoxy resin system that is used in a wide variety of floor coating applications. Ply-Guard EP can be used as a primer, finish coat, aggregate binder, slurry coat, or epoxy mortar. This material cures blush-free and provides an outstanding balance of physical strength, flexibility, and chemical resistance. Typical flooring applications include manufacturing facilities,...

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Adhesives for Your Specific Need

Fri, 07 Jul 2017 15:50:01 -0400

MasterSil 157: Addition Cured Silicone with Wide Temperature Serviceability MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and has the ability to transmit light very well from 220-2,500 nanometers. These properties are retained over the exceptionally broad service temperature range of -175°F to +500°F [-115°C to +260°C]. Highly flexible, it is capable of withstanding...

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Rapid Curing Two Component Epoxy Offers Impressive Chemical Resistance and High Bond Strength

Thu, 29 Jun 2017 13:06:23 -0400

Master Bond EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and superior electrical insulation properties. This versatile system is easy to handle and has a forgiving 100 to 25 mix ratio by weight. After mixing, EP41S-F polymerizes quickly and can usually be removed from a fixture within 20-30 minutes. Full cures are achieved in 24 hours at 75°F or in 45-60 minutes at...

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