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Temperature sensor

Tue, 16 Feb 2016 08:00:00 EST

A temperature sensor includes a clamp and a thermistor. The clamp is adapted to be inserted into an opening formed in an object, and has a shaft member. A flange member is extended from the shaft member in a direction orthogonal to an inserting direction in which the clamp is inserted into the opening. An engaging member extended from an end part of the shaft member toward the flange member in a direction inclined with the inserting direction. The thermistor is provided in the shaft member and is disposed in the end part. The engaging member and the flange member are adapted to clamp the object therebetween when the clamp is inserted into the opening.



Twisted sensor tube

Tue, 17 Nov 2015 08:00:00 EST

A sensor tube for protecting a sensor inserted into a moving process fluid is provided. The sensor tube includes a process interface section for mounting to a process vessel and an extended section extending from the process interface section to a sealed end. The extended section includes a twisted section having a longitudinal axis. The process interface section and the extended section define a sensor bore configured to receive a sensor therein. The twisted section has a cross section that includes at least three equally sized walls and wherein the walls form helixes along the longitudinal axis of the twisted section.



Apparatus and method for determining temperature

Tue, 06 Oct 2015 08:00:00 EDT

An apparatus and method for determining temperature is disclosed. An ultrasonic signal is generated that propagates through a buffer and a portion of the signal is reflected at an interface. A time of flight is measured between generating the ultrasonic signal and detecting the reflected portion. The temperature is determined based on the time of flight of the reflected signal.



Electronic oscillation circuit

Tue, 26 May 2015 08:00:00 EDT

An electronic oscillator circuit has a first oscillator, for supplying a first oscillation signal, a second oscillator, for supplying a second oscillation signal, a first controller for delivering the first control signal as a function of a phase difference between a first controller input and a second controller input of the first controller; a second controller for delivering the second control signal as a function of a phase difference between a first controller input of the second controller and a second controller input of the second controller; a resonator; at least a second resonance frequency, with a first phase shift dependent on the difference between the frequency of a second exciting signal and the second resonance frequency and processing means, for receiving the first oscillator signal and the second oscillator signal, determining their mutual proportion, looking up a frequency compensation factor in a prestored table and outputting a compensated oscillation signal.



Sample container with sensor receptacle and methods of use

Tue, 26 May 2015 08:00:00 EDT

Devices and methods are described herein that are configured for use in laboratory testing, such as, for example, during a procedure including the monitoring and detection of chemical reactions. For example, the systems and devices described herein can be used during a procedure to monitor and detect polymerase chain reactions (PCR). In some embodiments, a sample container includes a container body that defines an interior volume and has an open end in fluid communication with the interior volume. A cap is sealingly engageable with the open end of the container body. The cap defines a receptacle that is configured to extend within a portion of the interior volume of the container body when the cap is sealingly engaged thereto. The receptacle can receive therein a sensor, such as, a temperature sensor that can monitor the temperature of a sample material disposed within the container body.



Highly-reliable micro-electromechanical system temperature sensor

Tue, 26 May 2015 08:00:00 EDT

A micro-electromechanical system-type (MEMS) sensor arrangement for wirelessly measuring temperatures is disclosed. The MEMS sensor arrangement includes a multimorph sensor, a sensor coil coupled to the multimorph sensor, and a readout coil configured to be magnetically coupled to the sensor coil to i) energize the sensor coil, and ii) provide a readout of the natural frequency of the multimorph sensor, the sensor coil and the readout coil.



System and method for monitoring in real time the operating state of an IGBT device

Tue, 26 May 2015 08:00:00 EDT

A system and method are provided for monitoring in real time the operating state of an IGBT device, to determine a junction temperature and/or the remaining lifetime of an IGBT device. The system includes a differential unit configured to receive a gate-emitter voltage characteristic of the IGBT device to be measured and to differentiate the gate-emitter voltage characteristic to obtain pulses correlating with edges formed by a Miller plateau phase during a switch-off phase of the IGBT device. The system also includes a timer unit configured to measure the time delay between the obtained pulses indicating the start and end of the Miller plateau phase during the switch-off phase of the IGBT device, and a junction temperature calculation unit configured to determine at least one of the junction temperature of the IGBT device and/or the remaining lifetime of the IGBT device based on the measured time delay.



Ratio meter of a thermal sensor

Tue, 26 May 2015 08:00:00 EDT

A ratio meter includes a converter circuit, a first counter, a delay circuit, and a second counter. The converter circuit is configured to receive a temperature-independent signal, to convert the received temperature-independent signal into a first frequency signal during a first phase, to receive a temperature-dependent signal, and to convert the temperature-dependent signal into a second frequency signal during a second phase. The first counter is configured to receive the first frequency signal and to generate a control signal by counting a predetermined number of pulses of the first frequency signal count. The delay circuit is configured to delay the control signal for a predetermined time delay. The second counter is configured to receive the second frequency signal and to generate a count value by counting the second frequency signal.



Temperature sensor, manufacturing process and corresponding method of assembly

Tue, 26 May 2015 08:00:00 EDT

The invention relates to a temperature sensor comprising: a temperature-sensitive element (3); and a peripheral casing (7) accommodating the temperature-sensitive element (3) and having a closed end (9), the peripheral casing (7) being able to be inserted into a corresponding cavity (11), characterized in that the closed end (9) of the peripheral casing (7) has a peripheral portion (21) revealing, butted against the closed end, a flexible assembly stop (23) after said peripheral portion (21), said stop (23) being able to deform towards the peripheral portion (21) by shape cooperation with the bottom (15) of the corresponding cavity (11). The subject of the invention is also a process for manufacturing a temperature sensor as described above and a method of assembling said sensor.



Temperature detecting device, electro-optic device and electronic apparatus

Tue, 26 May 2015 08:00:00 EDT

A control unit sets a time interval for measuring a temperature of a liquid crystal panel as a first time interval (1 second), and thereafter measures the temperature of the liquid crystal panel each time the first time interval elapses. When the temperature of the liquid crystal panel is stabilized, the control unit sets a time interval for measuring the temperature of the liquid crystal panel as a second time interval (5 seconds). The control unit measures the temperature of the liquid crystal panel each time the second time interval elapses. Moreover, if an operation to change the amount of light reaching the liquid crystal panel is performed, the control unit restores the time interval for measuring the temperature of the liquid crystal panel to the first time interval.



Methods of preventing freezing of relays in electrical components

Tue, 26 May 2015 08:00:00 EDT

Disclosed herein are methods of preventing freezing of relays in electrical components operated in specific atmospheric conditions. One such method described herein comprises monitoring a temperature of a relay with a thermocouple located on a contact of the relay while monitoring ambient temperature within the relay. Operation of the electrical component is simulated in a sub-zero temperature and high humidity condition. A freeze potential of the relay is determined by plotting a temperature cross-over curve, wherein both the ambient temperature and the contact temperature are plotted during the operation and cool down period. If the high freeze potential is determined, one or both of the relay and the electrical component are modified with a modification configured to decrease the high freeze potential.



Control device for internal combustion engine

Tue, 19 May 2015 08:00:00 EDT

A control apparatus for an internal combustion engine having a means for performing a model calculation to calculate, as an exhaust temperature calculation value, the temperature of exhaust gas in an exhaust branch tube at the time of starting an engine, using a model representing the temperature behavior of the exhaust gas in the exhaust branch tube during stop of an engine; and an exhaust temperature actual measurement value output means for detecting the temperature of exhaust gas in the exhaust branch tube, and outputting the detected temperature as an exhaust temperature actual measurement value, wherein the model includes at least one parameter.



Thermal controller for semiconductor switching power devices

Tue, 19 May 2015 08:00:00 EDT

A thermal controller for driving a gate control unit of a gate-driven semiconductor switching device, the thermal controller comprising a junction temperature estimation module for generating an estimated junction temperature for the switching device, a gate voltage control module for modifying a gate voltage of the switching device, a switching frequency control module for modifying a switching frequency of the switching device, and a duty cycle control module for modifying the duty cycle of the switching device. In use, the thermal controller is adapted to activate one of the gate voltage control module, switching frequency control module and duty cycle control module dependent upon the estimated junction temperature in order to maintain the actual junction temperature below a pre-determined limit.



Thermal analyzer

Tue, 19 May 2015 08:00:00 EDT

A thermal analyzer (100) includes: a furnace tube (9) made of a transparent material; a heating furnace (3); a sample holding part (41, 42) arranged inside the furnace tube; a first support base (12); a second support base (14); a measurement chamber (30) connected to the furnace tube; a first movement part (22) for moving the first support base and the second support base between a measurement position, at which the furnace tube is connected to the measurement chamber, and a sample setting position, at which the sample holding part is exposed on a rear end side with respect to the furnace tube and the heating furnace; and a second movement part (24) for moving only the second support base to a sample observation position, at which the heating furnace is advanced and the furnace tube is exposed. Accordingly, the sample is observable from outside the exposed furnace tube.



Systems and methods for detecting combustor casing flame holding in a gas turbine engine

Tue, 19 May 2015 08:00:00 EDT

In a gas turbine engine that includes a compressor and a combustor, wherein the combustor includes a primary fuel injector within a fuel nozzle and a secondary fuel injector that is upstream of the fuel nozzle and configured to inject fuel into a flow annulus of the combustor, a method for detecting a flame holding condition about a fuel injector. The method may include the steps of: detecting an upstream pressure upstream of the secondary fuel injector; detecting a downstream pressure downstream of the secondary fuel injector; determining a measured pressure difference between the upstream pressure and the downstream pressure; and comparing the measured pressure difference to an expected pressure difference.



Identifying and amerliorating a deteriorating condition for battery networks in-situ

Tue, 12 May 2015 08:00:00 EDT

A temperature is measured for each terminal of the battery unit. The magnitude and sign of a temperature differential is calculated from the temperatures. The temperature differential is then correlated to a deteriorating condition of the battery unit.



Ion sources, systems and methods

Tue, 12 May 2015 08:00:00 EDT

Ion sources, systems and methods are disclosed. In some embodiments, the ion sources, systems and methods can exhibit relatively little undesired vibration and/or can sufficiently dampen undesired vibration. This can enhance performance (e.g., increase reliability, stability and the like). In certain embodiments, the ion sources, systems and methods can enhance the ability to make tips having desired physical attributes (e.g., the number of atoms on the apex of the tip). This can enhance performance (e.g., increase reliability, stability and the like).



Sensor arrangement and measuring arrangement

Tue, 12 May 2015 08:00:00 EDT

A sensor arrangement includes at least two sensor components. Each sensor component includes a housing with at least one sensor element. The housings each include at least one connecting device. The at least one connecting device can be used to mechanically connect the at least two sensor components to one another.



Integrated microelectronic package temperature sensor

Tue, 12 May 2015 08:00:00 EDT

Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.



On die thermal sensor of semiconductor memory device

Tue, 12 May 2015 08:00:00 EDT

An on die thermal sensor (ODTS) of a semiconductor memory device includes a high voltage generating unit for generating a high voltage having a voltage level higher than that of a power supply voltage of the semiconductor memory device; and a thermal information output unit for sensing and outputting a temperature as a thermal information code, wherein the thermal information output unit uses the high voltage as its driving voltage.



Temperature sensor having a frame made of a mineral material

Tue, 12 May 2015 08:00:00 EDT

The invention relates to a measuring sensor for measuring temperature in a chemical process, the measuring sensor comprising a measuring element supported on the frame of the measuring sensor and arranged in thermal contact with the process being measured, and measuring conductors connected to the measuring element for directing a measuring signal onward. The frame of the measuring sensor is made of mineral material.



Method of measuring temperature of component in processing chamber of substrate processing apparatus

Tue, 12 May 2015 08:00:00 EDT

A component in a processing chamber of a substrate processing apparatus, where a temperature may be accurately measured by using a temperature measuring apparatus using an interference of a low-coherence light, even when a front surface and a rear surface are not parallel due to abrasion, or the like. A focus ring used in a vacuum atmosphere and of which a temperature is measured includes an abrasive surface exposed to an abrasive atmosphere according to plasma, a nonabrasive surface not exposed to the abrasive atmosphere, a thin-walled portion including a top surface and a bottom surface that are parallel to each other, and a coating member coating the top surface of the thin-walled portion, wherein a mirror-like finishing is performed on each of the top and bottom surfaces of the thin-walled portion.



Electronic device

Tue, 12 May 2015 08:00:00 EDT

An electronic device includes a heat source, a heat-absorbing cold point, a thermally insulating material for insulating the heat source from the cold point with a conductivity at a use-temperature of electronic device, that is below a thermal-conductivity threshold, and a thermal bridge having first and second ends connected by pads to the heat source and the cold point, and a thermal switch. The thermal bridge extends between the two ends and switches reversibly between conductive and non-conductive states. It includes material of variable thermal conductivity capable of switching over, in response to an addition of energy, between a conductive phase and a resistive phase, and a control module for causing the thermal switch to switch between the conductive state and the resistive state.



Device for thermal adaption

Tue, 12 May 2015 08:00:00 EDT

The invention relates to a device for thermal adaptation, comprising at least one surface element arranged to assume a determined thermal distribution, said surface element comprising a first heat conducting layer, a second heat conducting layer, said first and second heat conducting layers being mutually thermally isolated by means of an intermediate insulation layer, wherein at least one thermoelectric element is arranged to generate a predetermined temperature gradient to a portion of said first layer. The invention also relates to an object such as a craft.



System and method for determining the blackbody temperature of an electrical discharge

Tue, 12 May 2015 08:00:00 EDT

A method for determining a blackbody temperature of an electrical discharge may include providing a radiometer with a sensor aperture, positioning a viewing aperture sheet between the sensor aperture and the electrical discharge, and providing the viewing aperture sheet with a viewing aperture therethrough, determining an area of the viewing aperture, determining a distance of the sensor aperture from the viewing aperture, observing the electrical discharge with the sensor aperture through the viewing aperture to obtain radiometer data, and calculating the blackbody temperature based at least on the radiometer data, the area of the viewing aperture and the distance of the sensor aperture from the viewing aperture.



Pyrometer

Tue, 12 May 2015 08:00:00 EDT

A non-contact pyrometer and method for calibrating the same are provided. The pyrometer includes a radiation sensor configured to measure at least a portion of a radiance signal emitted from a target medium and output a voltage that is a function of an average of the absorbed radiance signal, and an optical window disposed proximate the radiation sensor and configured to control a wavelength range of the radiance signal that reaches the radiation sensor. The pyrometer may further include a reflective enclosure configured to receive the target medium therein, wherein the radiation sensor and the optical window are disposed within the reflective enclosure, an amplifier in communication with an output of the radiation sensor, and a data acquisition system in communication with an output of the amplifier.



Method of estimating a floor temperature of a solid floor

Tue, 12 May 2015 08:00:00 EDT

A method of estimating a floor temperature of a solid floor that has a fluid conduit embedded in the floor. Provided is a control scheme that provides a sequence, where the concrete temperature can be estimated through the temperature of the fluid in the conduit embedded in the floor. After the concrete temperature is obtained, a heating sequence can be initiated for providing fast and accurate control of the floor temperature.



Thermodynamic phase equilibrium analysis based on a reduced composition domain

Tue, 05 May 2015 08:00:00 EDT

A method of modeling phase characteristics of thermodynamic systems utilizing pseudo-properties strategy and a reduced number of variables is disclosed herein. The method describes a means of determining the probability of phase splitting of mixtures of materials at a given temperature, pressure, and composition by characterizing the functions that describe the system via pseudo-properties, and also by describing the system in n−1 or fewer variables, where n represents the number of components in the system of interest. In an embodiment, a multi-component system is characterized in one variable, thereby providing simplified thermodynamic models in a time-efficient manner. In addition, the information generated by this reduced-variable calculation can further be used as a starting point for calculations of equations of state.



Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flashes of light

Tue, 05 May 2015 08:00:00 EDT

Radiant energy from a semiconductor wafer which is determined from the theoretical value of black body radiation and the actually measured result of an output from a photodiode are brought into correspondence with each other, and a table showing a correlation therebetween is acquired and stored on a magnetic disk. When a semiconductor wafer to be treated is irradiated with flashes of light from flash lamps, the photodiode receives radiant light emitted from the semiconductor wafer. A controller determines, from the output from the photodiode, the radiant energy emitted per unit time from the semiconductor wafer irradiated with flashes of light, based on the acquired table. The controller further determines the surface temperature of the semiconductor wafer from the determined radiant energy.



Heat transfer camera ring

Tue, 05 May 2015 08:00:00 EDT

A camera system includes a camera and a camera housing structured to at least partially enclose the camera. The camera comprises an internal heat sink thermally coupled to electronics of the camera and a lens ring positioned around a lens of the camera. The camera housing comprises a thermal conductor. An interior portion of the thermal conductor makes contact with the lens ring when the camera is enclosed within the housing, and an exterior portion extends outside the housing. The thermal conductor is configured to transfer heat from the interior of the housing to the exterior to dissipate heat from the camera's electronics.



Managing environmental control system efficiency

Tue, 05 May 2015 08:00:00 EDT

A method, system or computer usable program product for providing alerts of inefficiency of an environmental conditioning system including, responsive to a cycle initiation by the environmental conditioning system, measuring a difference between an intake temperature and an outlet temperature after a predetermined period of time, and responsive to the difference being below a minimum level, generating an alert.



Fluorescence based thermometry

Tue, 05 May 2015 08:00:00 EDT

A temperature sensor includes a photon source, a fluorescent element and a photodetector. The fluorescent element includes a temperature-insensitive first fluorophore and a temperature-sensitive second fluorophore. The photodetector includes a first photosensor exhibiting a first spectral responsivity and a second photosensor exhibiting a second spectral responsivity. To measure a temperature of a surface, the fluorescent element may be placed adjacent to the surface and irradiated with a photon beam. First photons emitted from the first fluorophore and second photons emitted from the second fluorophore are collected. The first and second photons may be transmitted as a single dichromatic beam to the photodetector. The photosensors generate two different photodetector output signals, the ratio of which may be correlated to temperature.



Temperature sensitive composite for photonic crystals

Tue, 05 May 2015 08:00:00 EDT

A composite photonic crystal comprising an inverse opal structure defining an ordered array of voids with a filler composition received within the voids. A property of the filler composition changes in response to a stimulus, such as a temperature change, thereby changing the band gap of radiation that is reflected by the composite photonic crystal.



Engine cooling system control

Tue, 05 May 2015 08:00:00 EDT

Methods and systems are provided for diagnosing each of a plurality of engine cooling system components including various valves and grill shutters. Each valve may be individually closed and opened for a specified duration, and corresponding changes in coolant temperature may be monitored. If all the components are functional, the various valves may be adjusted to stagnate coolant at the engine and expedite engine warm-up during a cold-start.



Sensor module for acquiring the temperature in the interior of a vehicle, and device for determining the temperature in the interior of a vehicle

Tue, 05 May 2015 08:00:00 EDT

A sensor module for acquiring the temperature in the interior of a vehicle is disclosed. The sensor module has a temperature sensor for acquiring the interior temperature, and a radiation sensor for acquiring an insolation. Information provided by the radiation sensor is used to correct the interior temperature acquired by the temperature sensor, and the temperature sensor and the radiation sensor are arranged in a common first housing and make electrical contact with conductor tracks of a carrier board via first contact elements. A device for determining the temperature in the interior of a vehicle with the aid of such a sensor module is also disclosed.



Plasma processing apparatus and temperature measuring method

Tue, 05 May 2015 08:00:00 EDT

A plasma processing apparatus and a temperature measuring method that may measure a temperature of an object in a processing chamber by a low-coherence interferometer without forming a hole in a holding stage or an upper electrode of the plasma processing apparatus, thereby performing a plasma process of a substrate with high precision and uniformity. The plasma processing apparatus is implemented by disposing a light source collimator outside of a light source window, disposing a light-receiving collimator outside of a light-receiving window, allowing a measurement light emitted from the light source collimator to pass through the light source window to be obliquely emitted to a surface of the object to be measured, and allowing the reflected measurement light to pass through the light-receiving window to be incident on the light-receiving collimator. The temperature of the object in the processing chamber may be measured by the low-coherence interferometer.



Micromachined thermistor and temperature measurement circuitry, and method of manufacturing and operating same

Tue, 05 May 2015 08:00:00 EDT

The present inventions, in one aspect, are directed to a temperature sensing apparatus comprising a micromachined thermistor configured to output voltage and/or current signals which are/is correlated to an ambient temperature. The micromachined thermistor includes a micromachined thermistor structure suspended over and released from the substrate, wherein the micromachined thermistor structure includes a temperature dependent characteristic (e.g., resistance to an electrical current), and electrical contacts connected to the micromachined thermistor structure, wherein the electrical contacts are adapted to conduct the voltage and/or current signals. The apparatus, in one aspect, includes measurement circuitry, to generate data which is representative of the ambient temperature using the electrical resistance of the micromachined thermistor structure.



Thermal sensor with second-order temperature curvature correction

Tue, 28 Apr 2015 08:00:00 EDT

Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.



Electronic contact thermometer

Tue, 28 Apr 2015 08:00:00 EDT

An electronic contact thermometer with shorter reactive time, which comprises a case; a circuit board which is installed in said case; a display; a switch; a power supply device; and a sensing part which is installed in one end of said case. Electrically connected with said circuit board; said display and switch are disposed on one side of said case; said sensing part comprises a positioning nugget that is installed in the same end of said case that the sensing part is installed. A temperature sensing chip; and 2 conducting lines which are electrically connected to the temperature sensing chip. Said metallic contact part is a round cap with flat contacting surface, which comprises positioning sticks on the surrounding wall, which connect to said positioning rods for making it protruding from but not contact to said case.



Sensor

Tue, 28 Apr 2015 08:00:00 EDT

An electrical temperature sensor (10) comprises a liquid crystalline material (12). First and second electrically conductive contacts (14), (16), having a spaced relationship therebetween, contact the liquid crystalline material (12). An electric property measuring device is electrically connected to the first and second contacts (14), (16) and is arranged to measure an electric property of the liquid crystalline material (12). The liquid crystalline material (12) has a transition temperature T at which it undergoes a phase change between polar and non-polar phases. The phase change between polar and non-polar phases causes a change in said electric property of the liquid crystalline material (12).



Method of calibrating a temperature sensor of a chemical microreactor and analyzer for biochemical analyses

Tue, 28 Apr 2015 08:00:00 EDT

A method of calibrating a temperature sensor of a chemical microreactor envisages: determining an airflow along a path in such a way as to cause a thermal exchange between the airflow and a chemical microreactor, which is provided with an on-board temperature sensor and is set along the path; and detecting a temperature in the airflow downstream of the microreactor, in conditions of thermal equilibrium.



Method and device for measuring deposit thickness

Tue, 21 Apr 2015 08:00:00 EDT

The present invention concerns a method for measuring the thickness of any deposit of material on the inner wall of a structure conducting a fluid stream of hydrocarbons, the method comprising the steps of: applying a first heat pulse or continuous heating to at least one first section of the structure removing deposits on the inner wall of the first section of the structure; applying a second heat pulse to both the first section of the structure and at least one second section of the structure, the first and second sections being spaced apart, which heat pulse does not loosen any deposit of material in the second section; measuring the temperature of the wall of the structure or the fluid during the second heat pulse at both the first and second sections; and determining the thickness of any deposit of material on the inner wall of the structure at the second section based on the measured temperatures. The present invention also relates to a corresponding device and arrangement.



Method for determining the temperature of a power semiconductor

Tue, 21 Apr 2015 08:00:00 EDT

A method for determining the temperature of a power semiconductor, wherein a first control contact is connected to a first pole of a series resistor integrated in the power semiconductor. A second pole—which continues to the power semiconductor—of the series resistor is connected to a second control contact. A first control contact and a second control contact are connected to a first connection terminal and second connection terminal via respective bonding wires. The resistance value of the series resistor is determined by an electrical measurement between the two connection terminals. On the basis of the resistance value and a temperature-resistance characteristic curve of the series resistor, the temperature of the power semiconductor is determined based on the temperature of the series resistor.



Overhead power connector integrity assessment by application of thermal history detectors

Tue, 21 Apr 2015 08:00:00 EDT

Systems and methods for monitoring the integrity of an overhead power connector are disclosed. The systems and methods may include applying a temperature sensitive material to at least a portion of an overhead power connector and/or an overhead power conductor. The integrity of the overhead connector may be monitored or diagnosed by monitoring the properties of the temperature sensitive material to determine if the overhead connector experienced any high temperature excursions.



Clothing dryer and control method thereof

Tue, 21 Apr 2015 08:00:00 EDT

A clothing dryer capable of effectively drying a small amount of substance, and a control method thereof by changing an algorithm of a sensor-dry course, which is configured to control an operation rate, a degree of drying or a temperature of drying, to be adapted to the small load of substance in a case where the substance to be dried has a small load when compared to the entire volume of the clothing dryer, so that the drying efficiency is enhanced regardless of the load of the substance, and a separate option button is provided for a sensor-dry course, so that a small load of substance is dried adaptively to the material characteristic of the substance for a respective dry course, thereby enhancing the drying efficiency.



Platform comprising an infrared sensor

Tue, 14 Apr 2015 08:00:00 EDT

An IR sensor includes a suspended micro-platform having a support layer and a device layer disposed thereon. IR absorbers are disposed in or on the device layer. IR radiation received by the IR absorbers heats an on-platform junction of each of a plurality of series-connected thermoelectric devices operating in a Seebeck mode, the devices producing a voltage indicative of the received IR. Other thermoelectric devices are used to cool the platform, and a pressure sensing arrangement is used to detect loss of vacuum or pressure leaks.



Apparatus for gentle laser treatment of the retina

Tue, 14 Apr 2015 08:00:00 EDT

A therapeutic laser with a source of pulsed electromagnetic radiation, a control device for controlling the intensity and/or the duration of the therapeutic laser applied to the tissue, and a detection device for detecting optoacoustic signals triggered by irradiating the living tissue with the pulsed electromagnetic radiation. The therapeutic laser is characterized by an evaluation device that acts on the control device and is used for calculating a degree of quality B(t) from the optoacoustic signals detected by the detection device for individual laser pulses applied to a predetermined laser spot and determining a fit function f(t) at a predetermined point in time Δt1, the fit function f(t) approximating the mean curve of B(t) for 0≦t≦Δt1. The intensity and/or the irradiation time of the therapeutic laser is defined by the parameters for the predetermined laser spot, the parameters being determined for the fit function f(t).



Temperature sensor

Tue, 14 Apr 2015 08:00:00 EDT

A temperature sensor includes a constant current source and a transistor stack connected to the constant current source. The transistor stack includes a first transistor having a base connected to the constant current source and a collector coupled to a supply voltage. The collector of the first transistor is electrically isolated from the base of the first transistor. The transistor stack includes a second transistor connected to the first transistor. The second transistor has a collector connected to an emitter of the first transistor and has a base connected to the collector of the second transistor. The transistor stack includes an output node disposed between the constant current source and the base of the first transistor. A voltage of the output node is indicative of a temperature.



Temperature sensor using delay circuit

Tue, 14 Apr 2015 08:00:00 EDT

A temperature sensor includes a signal delaying apparatus, a comparison apparatus, a multiplier and a counting apparatus. The signal delaying apparatus is configured to receive a step signal, perform a phase delay operation on the received step signal according to a temperature degree, and thereby forming a first output signal. The comparison apparatus is configured to receive the first output signal and the step signal, and accordingly output a second output signal. The multiplier is configured to receive the second output signal and a clock signal, and accordingly output a third output signal. The counting apparatus is configured to receive the third output signal, count the number of pulses of the third output signal, and generate a digital code accordingly.



Thermal sensors and methods of operating thereof

Tue, 14 Apr 2015 08:00:00 EDT

A thermal sensor includes a comparator having a first and second input nodes. A reference voltage generator is electrically coupled with the first input node. The reference voltage generator is configured to provide a reference voltage that is substantially temperature-independent. A temperature sensing circuit is electrically coupled with the second input node. The temperature sensing circuit is configured to provide a temperature-dependent voltage. The temperature sensing circuit includes a current mirror. A first metal-oxide-semiconductor (MOS) transistor is electrically coupled between the current mirror and ground. A first resistor is electrically coupled with the current mirror. A second MOS transistor is electrically coupled with the first resistor in series. The second MOS transistor and the first resistor are electrically coupled with the first MOS transistor in a parallel fashion.