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VCSEL packaging

Tue, 26 May 2015 08:00:00 EDT

A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.



Heat sink thermal press for phase change heat sink material

Tue, 19 May 2015 08:00:00 EDT

Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.



Structures for improving current carrying capability of interconnects and methods of fabricating the same

Tue, 19 May 2015 08:00:00 EDT

Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.



Apparatus and systems having an adsorbent contactor and swing adsorption processes related thereto

Tue, 19 May 2015 08:00:00 EDT

A method and apparatus are described for swing adsorption processes. The method includes obtaining different plates, wherein the plates have gaseous openings and a utility fluid opening. Then, the gaseous openings are substantially oriented along a common axis for gaseous openings and the plates are diffusion bonded. Once diffusion bonded, the gaseous openings within the module are wash coated with an adsorbent material.



Method of manufacturing electronic component unit

Tue, 19 May 2015 08:00:00 EDT

An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.



Brazing method of aluminum material and brazed structure

Tue, 19 May 2015 08:00:00 EDT

In order to enable a satisfactory fluxless brazing without needing flux or vacuum facilities, a brazing object including an aluminum alloy material provided with an Al—Si—Mg brazing filler metal is joined by the Al—Si—Mg brazing filler metal without the use of flux by heating the aluminum alloy material, when raising the temperature in a brazing furnace, at least in a temperature range of 450° C. to before melting of the filler metal under a first inert gas atmosphere having an oxygen concentration of preferably 50 ppm and following by heating at least at or above a temperature at which the filler metal starts to melt under a second inert gas atmosphere having an oxygen concentration of preferably 25 ppm and a nitrogen gas concentration of preferably 10% by volume or less. The oxygen concentration and nitrogen concentration in the atmosphere in the course of brazing are controlled in this way, whereby the reliability of a joint is remarkably improved, compared with conventional fluxless brazing methods, while suppressing cost increases as much as possible.



Friction stir welding with temperature control

Tue, 19 May 2015 08:00:00 EDT

A method for friction stir welding is provided. The method may include determining the temperature of one or both parts being welded. The parts may then be heated to a desired temperature and then friction stir welded together. By preheating the parts, the friction required to plasticize the parts during welding may be reduced. Thereby, the rotational speed of the friction stir welding tool may be reduced, and thus the tool life may be extended without decreasing the rate at which welds are created. Additionally, the cooling rate of the weld may be regulated with a thermal control device.



Workpiece arrangement

Tue, 12 May 2015 08:00:00 EDT

A workpiece arrangement includes at least two join regions of at least one workpiece that are joined together by a material-to-material connection seam. The material-to-material connection seam covers only a portion of a first of the at least two join regions. A thermal insulation device is disposed in an area of the material-to-material connection seam and corresponds to the first of the at least two join regions.



Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

Tue, 12 May 2015 08:00:00 EDT

An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.



Process for direct bonding two elements comprising copper portions and portions of dielectric materials

Tue, 12 May 2015 08:00:00 EDT

A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.



Unitized assembly including substructure element integral with fiber metal laminate

Tue, 12 May 2015 08:00:00 EDT

A unitized assembly may comprise a fiber metal laminate and at least one additive layer. The fiber metal laminate may have non-metallic plies bonded to metallic plies and may include an innermost metallic ply. The at least one additive layer may be deposited onto the innermost metallic ply by friction stir welding.



Laminated structure and method for producing the same

Tue, 05 May 2015 08:00:00 EDT

Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.



Automatic soldering equipment

Tue, 05 May 2015 08:00:00 EDT

Automatic welding equipment includes a wave soldering machine including a tank, a plurality of first nozzles, a first pump, and a first guide plate. The tank has an opening. The first nozzles and melted solder are disposed in the tank. The first pump is disposed in the tank for jetting the solder via the first nozzles. The first guide plate is located at the opening and includes a first plate portion and a second plate portion. The first plate portion is located over the first nozzles and has a plurality of first holes for passed through by the solder jetted from the first nozzles. The second plate portion, connected to the first plate portion, guides the solder to flow out of the first holes. The solder guided by the second plate portion passes through second holes of the second plate portion and returns into the tank.



Method for producing a plating of a vane tip and correspondingly produced vanes and gas turbines

Tue, 05 May 2015 08:00:00 EDT

The invention relates to a method for producing a plating (5) of a vane tip. Said method consists of the following steps: a) a vane having a vane tip which is arranged opposite the base of the vane (2) and which comprises a surface which points radially outwards is provided, and b) a porous layer (7) is applied to at least the surface (4) of the vane tip and/or c) a bulge (8) which increases the surface of the vane tip is applied to at least one part of the flanks of the vane tip, said flanks surrounding the surface of the vane tip, and d) the plating (5) is applied to the porous layer and/or the bulge. The invention also relates to corresponding vanes or gas turbines with corresponding vanes.



Apparatus for stud bump formation

Tue, 05 May 2015 08:00:00 EDT

An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.



Nuclear fusion reactor first wall component and production process thereof

Tue, 28 Apr 2015 08:00:00 EDT

A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behavior while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.



Method for welding a flange to a guide thimble tube in nuclear fuel assembly

Tue, 28 Apr 2015 08:00:00 EDT

Disclosed therein are an apparatus for and a method of welding a flange to a guide thimble tube in a nuclear fuel assembly. The automatic welding apparatus includes a welding unit located on an axially conveying line of a tube for welding a surface of the tube inserted thereinto and a surface of a flange, a flange supplying unit for supplying the flange at a tube inlet of the welding unit onto the axially conveying line, and a conveying unit mounted on the axially conveying line in such a way as to move the tube and the flange on the axially conveying line, so that they are inserted into and drawn from the welding unit.



Method for forming interposers and stacked memory devices

Tue, 28 Apr 2015 08:00:00 EDT

Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).



Method and apparatus to construct metal securement member for an aircraft

Tue, 28 Apr 2015 08:00:00 EDT

The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.



Friction welding

Tue, 28 Apr 2015 08:00:00 EDT

A welding tool for friction welding a workpiece, the tool including: a probe having a core including a ceramic material, the probe having a surface coating including a metallic material covering at least part of a contact zone of the probe.



Quick change over tooling for a welder

Tue, 28 Apr 2015 08:00:00 EDT

A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.



Method and device for producing welded connections

Tue, 28 Apr 2015 08:00:00 EDT

A method and machine for producing welded reinforcing steel rod mats for use in the production of DIN-conforming reinforced concrete components having primarily no static loads, and to such a reinforcing steel rod mat, uses a welding device, one or more reinforcing steel rods, and one or more stay braces in the case of uniaxial reinforcing steel mats, positioned relative to each other with position control and optionally with position correction of the reinforcing steel rods to be welded together, and a reinforcing steel rod is welded in the area of at least one of the ribs thereof to a stay brace, or to another reinforcing steel rod in the area of at least one of the ribs of the rod.



Substrate bonding apparatus

Tue, 28 Apr 2015 08:00:00 EDT

Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.



Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same

Tue, 21 Apr 2015 08:00:00 EDT

A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.



Aluminum alloy clad sheet for heat exchangers

Tue, 21 Apr 2015 08:00:00 EDT

An aluminum alloy clad sheet for heat exchangers includes a core material, a cladding material 1, and a cladding material 2, one side and the other side of the core material being respectively clad with the cladding material 1 and the cladding material 2, the core material containing 0.5 to 1.2% of Si, 0.2 to 1.0% of Cu, 1.0 to 1.8% of Mn, and 0.05 to 0.3% of Ti, with the balance being Al and unavoidable impurities, the cladding material 1 containing 3 to 6% of Si, 2 to 8% of Zn, and at least one of 0.3 to 1.8% of Mn and 0.05 to 0.3% of Ti, with the balance being Al and unavoidable impurities, and the cladding material 2 containing 6 to 13% of Si, with the balance being Al and unavoidable impurities, the cladding material 1 serving as the outer side of the aluminum alloy clad sheet during use.



Exhaust-gas treatment unit having high-temperature-resistant component of high-grade steel with a cobalt-containing coating and method for producing such an exhaust-gas treatment unit

Tue, 21 Apr 2015 08:00:00 EDT

A high-temperature-resistant component for an exhaust-gas treatment unit, an exhaust-gas treatment unit and a method for producing such a unit, include providing the component or the exhaust-gas treatment unit with a surface layer intended to prevent the formation of chromium carbide bridges during a brazing process for producing the exhaust-gas treatment unit.



Magnetic attachment structure

Tue, 21 Apr 2015 08:00:00 EDT

The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.



Solder joint reflow process for reducing packaging failure rate

Tue, 21 Apr 2015 08:00:00 EDT

In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.



Low void solder joint for multiple reflow applications

Tue, 21 Apr 2015 08:00:00 EDT

A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.



Bonding apparatus and bonding method

Tue, 21 Apr 2015 08:00:00 EDT

To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.



Welding target position measurement device

Tue, 21 Apr 2015 08:00:00 EDT

According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.



Apparatus for friction stir welding

Tue, 21 Apr 2015 08:00:00 EDT

One aspect of the disclosure relates to a friction stir welding apparatus. The friction stir welding apparatus includes a spindle housing and a pin tool concentric with an axis and rotatable relative to the spindle housing about the axis. The friction stir welding apparatus also includes a first shoulder not substantially rotatable relative to the spindle housing about the axis and a second shoulder not substantially rotatable relative to the spindle housing about the axis. The pin tool is rotatable relative to the first shoulder and the second shoulder.



Method and apparatus for interlocking load carrying elements

Tue, 21 Apr 2015 08:00:00 EDT

A method for interlocking structural steel components with a metal-filled interlock is disclosed herein. The method comprises placing a mold about aligned contoured portions of structural steel components and attaching a crucible and a spout to the mold. The crucible is charged with exothermic reactive metals which are ignited, forming a molten metal filler. The molten metal filler melts a metal plug in the crucible or spout and the molten metal filler flows into the mold and about the aligned contoured portions of the structural steel components. Cooling of the molten metal filler forms a metal-filled interlock. Molds for performing the disclosed method are also disclosed herein.



Methods of forming bump and semiconductor device with the same

Tue, 14 Apr 2015 08:00:00 EDT

Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.



Battery module and methods for bonding cell terminals of battery cells together

Tue, 14 Apr 2015 08:00:00 EDT

A battery module and methods for bonding cell terminals of battery cells together are provided. The battery module includes a first battery cell having a first cell terminal, and a second battery cell having a second cell terminal. The battery module further includes an exothermal reactive layer having first and second sides. The first and second sides are disposed adjacent to the first and second cell terminals, respectively. The exothermal reactive layer is configured to ignite to form a bonding joint between the first and second cell terminals in response to a laser beam contacting at least a portion of the exothermal reactive layer.



Corrosion resistant metal products

Tue, 14 Apr 2015 08:00:00 EDT

A billet includes a solid steel body and an alloy cladding. The cladding may include a square tube in which the body is inserted with an interface at which the cladding becomes bonded to the body when the billet is heated and rolled or otherwise worked into a ferrous product. At least one element composed of a mass of finely divided scavenging aluminum, titanium or magnesium, is placed in the tube adjacent the body and separate from the interface. The elements are advantageously compressed into briquettes which scavenge oxygen from residual air at the interface to prevent oxidation of the cladding at the interface. The tube may be closed to prevent gases outside the billet from penetrating to the interface. Alternatively, reliance may be placed on the briquettes to scavenge oxygen from the residual air and also from atmospheric air and furnace gases before they can penetrate to the interface.



Soldering apparatus

Tue, 14 Apr 2015 08:00:00 EDT

In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.



Welded hot-rolled high-strength steel structural members and methods

Tue, 14 Apr 2015 08:00:00 EDT

Hot-rolled high-strength steel elongated structural members and method of making same are disclosed by hot-rolling high-strength steel having a specific chemical composition to provide structural units. The units are then welded together to provide structural members of desired geometrical configuration including a thin web with opposed thicker flanges extending therefrom to increase the load bearing capacity of the members.



Method for producing welded steel pipe and welded steel pipe

Tue, 14 Apr 2015 08:00:00 EDT

Provided is a method for producing a welded steel pipe having excellent buckling resistance. The method for producing a welded steel pipe according to the present embodiment includes steps of: preparing a welded pipe, and expanding the welded pipe over the entire length thereof by using a pipe expanding head such that an undulation wavelength ratio D defined by Formula (1) is not more than 0.8, or not less than 1.8: D=p/λ (1), where p is an undulation wavelength in the axial direction of the welded steel pipe, and λ is a Timoshenko's buckling wavelength as defined by Formula (2): λ=3.44×(r×t)1/2 (2), where r is an inner radius of the welded steel pipe and t is a wall thickness of the welded steel pipe.



Solder joint

Tue, 07 Apr 2015 08:00:00 EDT

A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.



Removal apparatuses for semiconductor chips

Tue, 07 Apr 2015 08:00:00 EDT

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.



Tubular friction welding joining method without rotation of the tubulars

Tue, 07 Apr 2015 08:00:00 EDT

Tubulars are joined to each other without rotation of the tubulars. A coupling is placed between the aligned tubulars and is supported for rotation or oscillating about its longitudinal axis. The tubulars are clamped in a manner that allows a compressive force to be transmitted to the coupling as the coupling is rotated. An induction device can preheat each connection site before friction welding and/or provide heat as the connection is made and is allowed to cool down. The process can continuously create a string of casing or liner that can be run in or drilled into a wellbore.



Method for holding high speed friction spot joining tools

Tue, 07 Apr 2015 08:00:00 EDT

The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels.



Method and device for the friction stir welding of two components

Tue, 07 Apr 2015 08:00:00 EDT

A method for the friction stir welding of two components, in particular of two shell components of a fuselage structure of an aircraft and spacecraft, said method comprising the following method steps: positioning the two components relative to one another in such a way that a connection region is formed between the two components; friction stir welding the two components by means of a friction stir welding tool which penetrates the connection region in order to produce a weld which permeates the connection region with the formation of an unpenetrated weld edge portion of the connection region; and introducing internal compressive stresses, at least in the weld edge portion of the connection region. Further a device for the friction stir welding of two components, in particular of two shell components of a fuselage structure of an aircraft and spacecraft is provided.



Friction stir method and a pair of workpieces joined by such method

Tue, 07 Apr 2015 08:00:00 EDT

A friction stir method comprises causing a rotating probe (1) of a friction stir tool to enter a workpiece or a joint between a pair of workpieces (89), the or each workpiece being a low conductivity, high melting point metal or metal alloy. The probe (1) extends from a shoulder (4), or between shoulders, in contact with the workpiece(s) and rotates relative to the or each shoulder.



Wire loop forming systems and methods of using the same

Tue, 07 Apr 2015 08:00:00 EDT

A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.



Rotary tool

Tue, 07 Apr 2015 08:00:00 EDT

There is provided a tool for friction stir welding, in which a coating layer is less likely to peel off from a base material and excellent wear resistance is achieved. The tool for friction stir welding according to the present invention includes a base material (BM) and a coating layer. The BM includes a first hard phase (FP) formed by WC particles, a second hard phase (SP) and a binder phase (BP). The SP is formed by a compound of one or more metals selected from Ti, Zr, Hf, Nb, Ta, Cr, Mo, and W and one or more elements selected from nitrogen, carbon, boron, and oxygen, and is included in the BM at a volume ratio of 3% to 30%. The BP is included in the BM at a volume ratio of 8% to 28%. The FP is higher than the SP in terms of volume ratio.



Tube coupling apparatus having liquefiable metal sealing layer

Tue, 31 Mar 2015 08:00:00 EDT

A method for forming a fluid tight seal is disclosed. The method may make use of a first component having a first sealing surface, and a second component having a second sealing surface. The method may further involve coating one of the first and second sealing surfaces with a metallic film layer adapted to transform into a liquefied metallic layer when a temperature of one of the first and second surfaces exceeds a melting temperature of a metal used to form the metallic film layer. Once it becomes liquefied, the liquefied metallic layer forms a pressure-tight seal between the sealing surfaces.



Mark-off suppression in superplastic forming and diffusion bonding

Tue, 31 Mar 2015 08:00:00 EDT

A method of forming a pack in a die by superplastic formation and diffusion bonding comprises applying a forming pressure within the pack to expand the pack within the die; and supplying gas between the die and the pack to apply a back pressure around an outside of the pack while the pack is being expanded to counteract the forming pressure to reduce surface mark off.



Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells

Tue, 31 Mar 2015 08:00:00 EDT

A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.