Tue, 16 Feb 2016 08:00:00 ESTThere is provided a structure for connecting a wiring member to a bus bar in which smooth connection is enabled while ensuring high reliability. In an end portion of a bus bar, a soldering portion which is smaller in cross-sectional area than the bus bar is formed. A connection projecting piece which is raised up in a pin-like manner is formed on the soldering portion. The connection projecting piece is passed through a connection hole which is formed in a connection end of a branch wiring portion of a wiring member configured by a flexible printed circuit board. The connection projecting piece which is passed through the connection hole is soldered to a circuit pattern.
Tue, 25 Aug 2015 08:00:00 EDTThere is provided a resin composition for a foamed resin by generating bubbles, the resin composition made of a blend of a base resin and a polymer material other than the base resin, the polymer material dispersed in the base resin, in which: the bubbles are generated at circumference of the dispersed polymer material by infusing a foaming gas into the resin composition at a predetermined processing temperature; and melting point or glass transition temperature of the polymer material is between melting point of the base resin and the processing temperature.
Tue, 28 Jul 2015 08:00:00 EDTThe disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method.
Tue, 07 Jul 2015 08:00:00 EDTThe present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.
Tue, 23 Jun 2015 08:00:00 EDTA flexible printed wiring board capable of preventing plated leads from peeling off due to repeated insertion and extraction of a connector connecting portion into and from a connector without bringing about an increase in the whole length of the flexible printed wiring board even when the flexible printed wiring board is a one-sided or double-sided one. First plated leads are provided in a manner extending from conductor patterns located outermost in a width direction of the connector connecting portion among a plurality of conductor patterns and reaching sides of the flexible printed wiring board in a width direction. Second plated leads are provided in a manner extending from leading ends of the other conductor patterns among the plurality of conductor patterns in a direction in which the connector connecting portion is inserted into the connector and reaching a leading end face of the flexible printed wiring board.
Tue, 16 Jun 2015 08:00:00 EDTEmbodiments of the present invention provide a wiring substrate having a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among a plurality of the projection electrodes is a variant projection electrode which has a recess portion on an upper surface, an outer diameter at the upper end that is larger than an outer diameter at the lower end, and a reverse trapezoidal cross-section shape. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode.
Tue, 09 Jun 2015 08:00:00 EDTA theft deterrent cable may be provided. First, a plurality of unique codes may be created. Then a plurality of indicia may be placed periodically and longitudinally on the interior of the cable that may not be viable from the exterior of the cable. The plurality of indicia may respectively correspond to the plurality of unique codes. An indicator may be placed on the exterior of the cable. In a database, the plurality of unique codes may be assigned to an organizational entity. The organizational entity may comprise a first enterprise. Next, an indication that the cable is to be transferred from the first enterprise to a second enterprise may be received. In response to the received indication, the plurality of unique codes may be assigned in the database from the organizational entity comprising the first enterprise to the organizational entity comprising a second enterprise.
Tue, 26 May 2015 08:00:00 EDTA lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
Tue, 26 May 2015 08:00:00 EDTA printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad and defines at least one via under the at least one first signal pad. The daughterboard includes at least one second signal pad and defines at least one via under the at least one second signal pad. The at least one first signal pad and the at least one second signal pad are sucked into the respective vias on the motherboard and the daughterboard according to siphon principle to allow each of the first signal pads and the second signal pads to form uneven top surfaces, the uneven top surfaces of the at least one first signal pads and the at least one second signal pads are connected to each other for electronically connecting the daughterboard to the motherboard.
Tue, 26 May 2015 08:00:00 EDTAn electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.
Tue, 26 May 2015 08:00:00 EDTA system for securing an access opening of a cable raceway using a single padlock includes a cover having a securing wall and opposed first and second sidewalls, which form a channel for accommodating at least a portion of the cable raceway with the securing wall covering the access opening. First and second insert bars engage the first and second sidewalls and a lock bar engages the first and second insert bars and may be locked in an engaged position to prevent the first and second insert bars from being disengaged with the cover and to secure the cover about the cable raceway preventing access to the access opening.
Tue, 26 May 2015 08:00:00 EDTIn a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.
Tue, 26 May 2015 08:00:00 EDTA portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.
Tue, 26 May 2015 08:00:00 EDTThe present invention discloses a tape substrate for chip on film structure of a liquid crystal panel. The tape substrate is provided with plural package units of chip on film structures arranged along its longitudinal direction, and the package unit has a driver chip, input leads and output leads. The longitudinal direction of the driver chip is parallel to the longitudinal direction of the tape substrate, and the input leads and the output leads are located at the two opposite sides of the driver chip. Each package unit is set up with a short side and a long side, and the input leads are formed at the short side, while the output leads are formed at the long side. In the package units adjacent to each other, the short side of one package unit joins the long side of a next package unit. This invention further discloses a liquid crystal panel having the tape substrate.
Tue, 26 May 2015 08:00:00 EDTReinforcement devices and systems for holding a traffic control assembly in compression are provided. The traffic control assembly includes a traffic signal disconnect hanger and/or a traffic signal and a first span wire positioned above the traffic control assembly. In some embodiments, the reinforcement device includes an upper support device connected to the first span wire where the upper support device has a length that is greater than a width of the traffic control assembly and the upper support device is configured to spread the load of the traffic signal assembly to the first span wire. The reinforcement device includes a lower support device operably connected to the traffic signal, a first vertical support member, and a second vertical support member where the first and second vertical members are tensioned when the upper support device, the lower support device and the first and second vertical support members are connected together.
Tue, 26 May 2015 08:00:00 EDTA bracket and open back junction box assembly allows simplified wiring at a construction site. An open back junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads, at a prefab facility. A Metal Clad (MC) cable may be attached to the open back junction box and wires carried in the MC Cable may be connected to the leads. A mounting bracket is generally sandwiched between the open back junction box and the plaster ring for mounting to framing members at the construction site. Following assembly at the prefab facility, the prefab open back junction box is shipped to the construction site where the bracket and open back junction box assembly is mounted to framing members. Connections to wires carried by MC Cables are then facilitated by removing the rear cover plate to access the open back junction box interior.
Tue, 26 May 2015 08:00:00 EDTA fastening mechanism for an electronic device, which has a shell body and a cover having a first fastening structure, includes a press portion adapted to be exposed from the shell body and pressable to extend resiliently into the shell body, and a second fastening structure adapted to engage to and disengage from the first fastening structure to prevent and permit removal of the cover from the shell body, respectively. A resilient component is adapted to be provided in the shell body, stores a restoring force when the cover is coupled to the shell body, and releases the restoring force when the second fastening structure is disengaged from the first fastening structure for biasing the cover away from the shell body.
Tue, 26 May 2015 08:00:00 EDTA shielded cable fixing structure includes a shielded cable that includes an electric wire, a braid for covering the electric wire, and a sheath for covering the braid, an insulation housing that receives a terminal fitting electrically connected to the electric wire, a pair of split shield shells in which the insulation housing is mounted, a groove-shaped portion press-formed on a section of each of the split shield shells to cover a wire lead-out port of the insulation housing, from which the electric wire is led out, and is recessed on an outer surface of each of the split shield shells, and a braid fixing member fixed on an annular mounting groove constituted by the groove-shaped portions of the split shield shells, in a state where the braid is disposed between the annular mounting groove and the braid fixing member.
Tue, 26 May 2015 08:00:00 EDTA shielding structure for a wire harness includes a seal member which has a wire through hole that allows the wire to pass therethrough while sealing a circumference of the wire. The wire has a structure where an insulating resin layer is formed on an outer circumference of a conductor, and a predetermined range in a length direction of the conductor is coated with a shield layer formed by resin plating to cover an outer circumferential surface of the insulating resin layer. A terminal portion of the wire is passed through the wire through hole of the seal member to be introduced into the shield wall to a position where the shield layer exists, whereby an inner circumference of the wire through hole is made in close contact with the shield layer to cause the shield layer and the seal member to be electrically conducted with each other.
Tue, 26 May 2015 08:00:00 EDTA mounting board having a plurality of terminals. The ends of each of the plurality of terminals are inserted into and soldered to through-holes positioned in a printed board, and the terminals are mounted on the printed board. A plurality of pedestals are disposed on one side of the printed board. The pedestals support the terminals. The pedestals are integrally coupled to one another through deformable coupling portions. Mutual displacements among the pedestals are allowed by the coupling portions.
Tue, 26 May 2015 08:00:00 EDTA multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.
Tue, 26 May 2015 08:00:00 EDTIn some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
Tue, 26 May 2015 08:00:00 EDTA contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
Tue, 26 May 2015 08:00:00 EDTThere is provided a multilayer ceramic electronic component comprising a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface thereof is defined as W, and a thickness thereof is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers therebetween, wherein the ceramic body includes an active layer and cover layers and in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region, are defined as ta and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.
Tue, 26 May 2015 08:00:00 EDTA wiring body connection structure includes a first wiring body and a second wiring body, the first wiring body having a first base material made of an elastomer and a first wiring containing an elastomer and a conductive material, the second wiring body having a second base material and a second wiring. In the wiring body connection structure, a laminated section is partitioned where a first end of the first wiring body and a second end of the second wiring body overlap in a front-rear direction. The wiring body connection structure further includes a cover member arranged on a front surface of the first wiring body, and a conductive adhesive layer bonding the first end and the second end in the laminated section while ensuring a conductive property. The cover member is interposed between a frontmost end of the second end and the first wiring in the laminated section.
Tue, 26 May 2015 08:00:00 EDTThe present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.
Tue, 26 May 2015 08:00:00 EDTA wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
Tue, 26 May 2015 08:00:00 EDTIn a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
Tue, 26 May 2015 08:00:00 EDTAn attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.
Tue, 26 May 2015 08:00:00 EDTThe present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.
Tue, 26 May 2015 08:00:00 EDTA capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at the edge of the first surface of the transparent substrate, the light-shield layer forms a non-visible region on the first surface of the transparent substrate; and a polymer layer, formed on the first surface of the transparent substrate, and covering the light-shield layer, the surface of the polymer layer is patterned to form a meshed trench, the trench is filled with conductive material to form a sensing region on the surface of the polymer layer. The capacitive transparent conductive film can effectively protect the conductive material and has low cost and good conductivity. A preparation method of the capacitive transparent conductive film is also provided.
Tue, 26 May 2015 08:00:00 EDTA method of manufacturing a wiring substrate, includes obtaining a laminated body in which a first copper tin alloy layer and a copper layer are arranged in sequence on a first coupling agent layer, on a first insulating resin layer, forming a seed layer on the copper layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a metal plating layer in the opening portion of the plating resist by applying an electroplating that utilizes the seed layer as a plating power feeding path, removing the plating resist, and forming a first wiring layer on the first coupling agent layer by etching the seed layer, the copper layer, and the first copper tin alloy layer while using the metal plating layer as a mask.
Tue, 26 May 2015 08:00:00 EDTA printed circuit board is manufactured by forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly, forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly, forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer, forming a second metal layer on the wall surface of the grooves in the wiring structure portion, and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board.
Tue, 26 May 2015 08:00:00 EDTA wiring substrate with spring terminal, includes a wiring substrate including a first face and a second face on an opposite side to the first face, and a spring terminal mounted on the first face of the wiring substrate, wherein a wiring layer provided on the first face of the wiring substrate includes a first wiring pattern connected electrically to the spring terminal, and a first ground pattern grounded to a ground potential, and the first ground pattern is insulated from the first wiring pattern, and is formed on the first face to surround the first wiring pattern.
Tue, 26 May 2015 08:00:00 EDTA novel method and apparatus for performing the method is disclosed the apparatus comprises a laser (17), at least one ink jet print head (14), means for holding a transparent substrate having a transparent conductive layer, means (22) for adjusting the relative positions of the laser and at least one ink jet print head to the transparent conducting layer (2) and a controller to control the laser and ink jet print head whereby in a first step to inkjet print one or more coarse metal borders (15) onto the deposited TCM layer and in a second step by means of a single laser ablation process, ablating tracks in both the metal border and underlying TCM layer to form a plurality of discrete electrical busbars (12) and optionally also to form electrodes in the remainder of the TCM layer.
Tue, 26 May 2015 08:00:00 EDTDisclosed are polymeric compositions with improved breakdown strength. The polymeric compositions contain a polyolefin and a voltage stabilizing agent. The voltage stabilizing agent contains a triazine. The triazine may include a substituent that enables keto-enol tautomerism, which provides the voltage stabilizing agent with additional energy dissipation capacity. The present polymeric compositions exhibit improved breakdown strength when applied as an insulating layer for power cable.
Tue, 26 May 2015 08:00:00 EDTA LAN cable includes an unshielded LAN cable including one or plural pairs of pair twisted wires and a sheath formed collectively covering a periphery of the pair twisted wires. The sheath includes a resin including nickel hydroxide at a mixing mass ratio of not less than 25% and not more than 60%.
Tue, 26 May 2015 08:00:00 EDTA cable having a cable structure comprising a stranded wire formed by stranding a plurality of stranded conductors and an inclusion that is more deformable than the stranded conductors, wherein a plurality of stranded conductors are arranged on a circumference of the inclusion.
Tue, 26 May 2015 08:00:00 EDTA metal-clad cable assembly comprising a metal sheath disposed around a conductor assembly. The metal sheath contains spaced apart crowns and valleys defining an outer surface of the metal sheath. The cable assembly includes coded information formed within the metal sheath, the coded information providing a characteristic and/or an intended application of the metal-clad cable assembly.
Tue, 26 May 2015 08:00:00 EDTA cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.
Tue, 26 May 2015 08:00:00 EDTA high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI) or DisplayPort standards, and includes a raw cable and a boost device. The raw cable includes coaxial lines of a characteristic cable impedance lower than the impedance implied in the standards. The correct impedance is observed at the sending end by series resistors mounted in the first cable connector. The resultant loss of signal is made up with the boost device mounted in the connector at the other end of the cable.
Tue, 26 May 2015 08:00:00 EDTThe present invention provides a safety device for protecting a person from an electrical shock while working on a live electrical wire connected to a terminal within an electric meter or circuit breaker box. The safety device comprises an inner cylinder slideably engaged within an outer cylinder and a spring disposed between the two cylinders for extending the outer cylinder axially outwardly with respect to the inner cylinder. The cylinders are made of nonconducting material. The inner cylinder engages insulation that covers the wire proximate to a bare end of the wire, which is connected to the terminal by a screw. When the person loosens the screw and the wire becomes disconnected from the terminal, the spring forces the outer cylinder outwardly to cover the bare end of the wire, which helps to protect the person from electrical shock.
Tue, 26 May 2015 08:00:00 EDTA harness is provided comprising a body having a series of electrical conductors embedded therein and substantially running along the length thereof. The body may be part of a structural component such as stringer.
Tue, 26 May 2015 08:00:00 EDTA solar power inverter having a sealing means includes: a main case having an opening on a front surface thereof, the opening open and closed by a main cover; an auxiliary case coupled to one side surface of the main case, and having a second opening on a front surface thereof, the second opening open and closed by an auxiliary cover; and a gasket interposed between the main case and the auxiliary case, wherein the main case and the auxiliary case are coupled to each other by coupling bolts which pass through the main case, the gasket and the auxiliary case.
Tue, 26 May 2015 08:00:00 EDTOne aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space. One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.
Tue, 26 May 2015 08:00:00 EDTAn electronic device with an inbuilt mechanism sealing unused interface holes, or gaps, against dust is disclosed. The dust-proof mechanism includes two blocking members and two elastic members. The two blocking members are movably mounted on a bottom wall of a housing and close an interface hole in the manner of drawn curtains. The two blocking members are urged together by the elastic members. When an object is inserted into the interface hole, the guiding surfaces guide and ride over the inserted object, moving the two blocking members away from each other. When the object is pulled out of the interface hole, the two blocking members are moved back toward each other by the elastic members.
Tue, 26 May 2015 08:00:00 EDTA box includes a first cover and a second cover have engaging mechanisms which engage the one end of the first cover to the one end of the second cover, and have retaining mechanisms which retain the other end of the first cover to the other end of the second cover. The first cover and the second cover are fit to each other in a normal state when the engaging mechanisms are engaged with each other and the retaining mechanisms are retained normally. When an engagement between the engaging mechanisms is in an abnormal state, a projection abuts against at least the other of the one end of the first cover and the one end of the second cover so that a gap is formed and the interior component housed in the internal space can be seen through the gap.
Tue, 26 May 2015 08:00:00 EDTA multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.
Tue, 19 May 2015 08:00:00 EDTA composite barrier-type Nb3Al superconducting multifilament wire material comprises Nb barrier filaments, Ta barrier filaments, Nb bulk dummy filaments, and a Nb or Ta covering. In the composite barrier-type Nb3Al superconducting multifilament wire material, the Nb barrier filaments and Ta barrier filaments are disposed in the wire material so that the Nb barrier filaments are concentrated in a filament region near a core formed from the Nb bulk dummy filaments and only the Ta barrier filaments are disposed or the Nb barrier filaments are dispersed in the Ta barrier filaments in an outer layer portion formed from a region outside the Nb barrier filaments, excluding the Nb or Ta covering.
Tue, 19 May 2015 08:00:00 EDTThe terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.