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ROTATION CONTROL METHOD, INFORMATION PROCESSING DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM STORING ROTATION CONTROL PROGRAM

Thu, 06 Apr 2017 08:00:00 EDT

A rotation control method, includes: calculating, by a processor in an information processing device, a first difference between a temperature of a component in the information processing device and an upper limit of a tolerable temperature for the component; calculating a second difference between a temperature of an environment in which the information processing device is installed and an upper limit of a tolerable temperature for the environment; and setting a rotation speed of a fan for cooling down the component, based on a comparison result between the first difference and the second difference.



Facility Including Externally Disposed Data Center Air Handling Units

Thu, 06 Apr 2017 08:00:00 EDT

Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.



LAYERED AIRFLOW COOLING FOR ELECTRONIC COMPONENTS

Thu, 06 Apr 2017 08:00:00 EDT

Baffles separate cooling air into layers and then reduce or prevent mixing of cooling air with air that has been heated by thermal contact with electronic components mounted on a printed circuit board (PCB). Some baffles include an exhaust chamber surface with an exhaust outlet and at least one passage exit. A plurality of cooling chamber surfaces define cooling chambers. Each cooling chamber surface has an inlet for cooling air, an electronics component threshold for pulling heat into the air from the electronic components, and at least one exhaust for heated air. Exhaust passages may connect a cooling chamber to the exhaust chamber; cooling chambers may also exhaust warmed air directly. Chamber surfaces may be parallel, or angled, relative to the PCB. Thresholds may be open, or closed but thermally conductive. Moving parts are not necessarily required in a baffle. Air temperature and flow may be sensed and acted upon.



Printed Circuit Board Clip

Thu, 06 Apr 2017 08:00:00 EDT

In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.



SERVER HAVING A LATCH

Thu, 06 Apr 2017 08:00:00 EDT

Example techniques for using a release latch to access a second tray of a server are disclosed. An example method includes operating a server in a rack. A release latch is engaged to initiate movement of a first tray of the server away from a second tray located behind the first tray. The second tray can then be accessed to remove and replace a storage drive from the second tray while the server remains in operation.



ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE

Thu, 06 Apr 2017 08:00:00 EDT

An electronic device including a waterproof structure is provided. The electronic device includes a housing that includes a first face, a second face that faces in a direction substantially opposite to the first face, and a side surface that at least partially encloses a space between the first face and the second face, a middle plate arranged between the first face and the second face inside the housing to be substantially parallel to the first face, extending from the side surface, and including at least one opening, a printed circuit board arranged between the middle plate and the second face, a display arranged between the middle plate and the first face, and including a face directed toward the second face, and a seal member configured to hermetically seal the at least one opening of the middle plate, and arranged between the face of the display and the middle plate.



DISPLAY APPARATUS AND METHOD FOR MANUFACTURING SAME

Thu, 06 Apr 2017 08:00:00 EDT

A display apparatus includes a window member, a display module, and a photocured adhesive layer. The window member includes a base member and a bezel layer overlapping a partial region of a rear surface of the base member, the bezel layer including a photosensitive material having a reduced transmittance with an increased amount of irradiated light. The display module is disposed on the lower side of the window module. The photocured adhesive layer is configured to bind the window member to the display module, and overlaps with the bezel layer on a plane.



MOVABLE DIGITAL DISPLAY FOR DISPLAYING SCENES WITHIN A WINDOW FRAME

Thu, 06 Apr 2017 08:00:00 EDT

A movable digital display includes pivotable left and right side brackets. Each of the brackets has a connector coupled to a first end of a rod. The connector pivotally attaches to a window frame. An orifice is positioned proximate a second end of the rod. Each of the brackets has a shaft with a first terminus and a second terminus. There is a fastener coupled to the first terminus of the shaft. The fastener is configured to pivotally attach to the digital display. There is an aperture proximate to the second terminus of the shaft. The aperture is complimentary to the orifice of the rod. Each of the brackets has a pivot pin extending through the orifice and the aperture, such that the rod and the shaft are coupled and such that the rod and the shaft are able to pivot relative to the pin.



DISPLAY DEVICE

Thu, 06 Apr 2017 08:00:00 EDT

A display device includes: a display panel which displays an image with light and a drive unit which is electrically connected to the display panel and drives the display panel. The drive unit includes a drive circuit board and a drive circuit film. The drive circuit board overlaps the display panel, generates a drive signal to drive the display panel and defines a receiving hole therein. The drive circuit film electrically connects the display panel to the drive circuit board and is bent from the display panel toward the drive circuit board. The drive circuit film includes a driver chip which provides a control signal in response to the drive signal from the drive circuit board. The driver chip is received in the receiving hole defined in the drive circuit board.



RECEPTACLE ASSEMBLY AND MODULE ASSEMBLY

Thu, 06 Apr 2017 08:00:00 EDT

In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.



ELECTRONIC MODULE COMPRISING FLEXIBLE CONDUCTING MEMBER CONNECTED THERETO AND METHOD OF CONNECTING FLEXIBLE CONDUCTING MEMBER TO ELECTRONIC MODULE

Thu, 06 Apr 2017 08:00:00 EDT

According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.



COMPOSITE ELECTRONIC COMPONENT AND BOARD ON WHICH COMPOSITE ELECTRONIC COMPONENT IS MOUNTED

Thu, 06 Apr 2017 08:00:00 EDT

A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.



SCALABLE THERMAL SOLUTION FOR HIGH FREQUENCY PANEL ARRAY APPLICATIONS OR OTHER APPLICATIONS

Thu, 06 Apr 2017 08:00:00 EDT

An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.



GROUNDING ROPE FOR A SHAFT GROUNDING APPARATUS OF A DYNAMO-ELECTRIC MACHINE

Thu, 06 Apr 2017 08:00:00 EDT

A grounding rope assembly for electrically grounding a rotatable conductive shaft of a dynamo-electric machine. The assembly includes a grounding rope member including a plurality of conductive wires extending along the length of the grounding rope member and one or more discrete fixation points intermediate the first and second ends of the grounding rope member. Two or more of the plurality of conductive wires are affixed together at each of the discrete fixation points.



ESD Protection System Utilizing Gate-Floating Scheme and Control Circuit Thereof

Thu, 06 Apr 2017 08:00:00 EDT

An ESD protection system for an internal circuit is disclosed. The ESD protection system comprises an ESD clamping device connected between a pad and a ground of a first domain); a pre-driver having an output coupled to a gate of the ESD clamping device); an ESD control circuit connected between the pre-driver and the internal circuit; and a transient detection unit coupled to the ESD control circuit, configured to detect an ESD transient from the pad of the first domain. The transient detection unit outputs an first signal to the control circuit upon detection of an ESD transient. In response, the control circuit causes the pre-driver to output a high-impedance state at the gate of the ESD clamping device, thereby floating the gate thereof.



SURGE ARRESTER OF AN AIRFIELD LIGHTING SYSTEM AND A SECONDARY CIRCUIT OF AN AIRFIELD LIGHTING SYSTEM

Thu, 06 Apr 2017 08:00:00 EDT

A surge arrester of an airfield lighting system, wherein the airfield lighting system includes a primary circuit having a plurality of transformers with primary windings and secondary windings, the primary windings of the transformers being connected in series in the primary circuit and at least one of the secondary windings of the transformers is adapted to feed electric power to a secondary circuit having an illumination device of the airfield lighting system, wherein the surge arrester includes a hermetically sealed enclosure for protecting the circuitry of the surge arrester and connectors for electrically connecting the surge arrester to the secondary circuit, the surge arrester being adapted to provide a low impedance current path to ground for excessive voltages.



PROTECTING CIRCUIT AND INTEGRATED CIRCUIT

Thu, 06 Apr 2017 08:00:00 EDT

A protecting circuit includes: a discharge switch configured to connect to a first terminal and a second terminal; a trigger circuit comprising load devices configured to be connected in series between the first terminal and the second terminal, each of the load devices being configured to consume power; and a shunt circuit comprising, between the trigger circuit and the first terminal or the second terminal, at least one shunt pathway configured to be capable of bypassing at least one of the load devices. The trigger circuit is configured to turn on the discharge switch when a voltage between the first terminal and the second terminal is higher than a first voltage value, and the shunt circuit is configured to electrically connect the shunt pathway when the voltage is higher than a second voltage value that is greater than the first voltage value.



MACHINE HAVING AT LEAST ONE MOTOR AND ONE MACHINE PROTECTION CIRCUIT

Thu, 06 Apr 2017 08:00:00 EDT

A machine, specifically a pump, a compressor, an agitator or a hoist, includes at least one motor and one machine protection circuit that includes a measurement device having at least one sensor for monitoring at least one parameter of the machine and includes an analysis device for analysing the parameters measured by the sensor and for activating a machine protection relay for switching off the machine. A switch cabinet positioned away from the machine is provided, and the machine protection circuit is spatially separated by the measurement device being arranged in the machine, and by the analysis device and the machine protection relay being arranged in the switch cabinet.



DISCONNECT SWITCH FOR DIRECT CURRENT INTERRUPTION

Thu, 06 Apr 2017 08:00:00 EDT

A disconnecting device for interrupting the direct current between a direct current source, in particular in the direct voltage range between 300VDc and/or in the nominal current range between 4 A and 250 A, and a load. The device has at least one protection switch with a protection switch arrangement having a magnetic trigger, and has semiconductor electronics which are connected in parallel to the at least one protection switch and which block the current when the protection switch arrangement is in a current-conducting state and which conducts current at least temporarily when the protection switch arrangement is triggered. A current, in particular an electric arc current generated as a result of an electric arc, is switched, when the protection switch arrangement is triggered, from the at least one protection switch to the semiconductor electronics.



System for Isolating Power Conductors Using Molded Assemblies

Thu, 06 Apr 2017 08:00:00 EDT

An improved electrical system may be provided by electrically isolating horizontal power distribution bus bars of differing phases, disposed along a preconfigured isolated bus support molding, from one another by covering each bus bar with an electrically insulating molded assembly. The electrically insulating molded assembly has contours configured to cover a particular bus bar (with respect to another bus bar or live fastener), arranged within the constraints of the preconfigured isolated bus support molding in the electrical system (such as along the back of the isolated bus support, between the isolated bus support and a wall of the electrical system).



System for Isolating Power Conductors Using Cover Assemblies

Thu, 06 Apr 2017 08:00:00 EDT

An improved electrical system may be provided by electrically isolating exposed live fasteners and bus clamps in power distribution systems by attaching electrically insulating snap-based cover assemblies to the live fasteners and bus clamps. A cover assembly may include a plate element and an electrically insulating cap element. The plate element may have a plate opening and a beveled edge, and the electrically insulating cap element may have a cap edge followed by an interior recess. The cap element and the plate element may be held together by snapping the cap element over the plate element such that the beveled edge fits into the interior recess and the cap edge fits below the beveled edge. The cover assembly may be attached to a fastener or bus clamp via the plate opening.



Flexible Micro-Electronics Circuits with Crack Mitigation

Thu, 06 Apr 2017 08:00:00 EDT

An electronic circuit device that includes a plurality of electrical circuits disposed on a support substrate, such as an electronic display device, includes one or more primary electrodes that extend along a trace on the support substrate, wherein the primary electrodes form one or more primary electrical pathways of or to one or more of the electrical circuits. One or more secondary electrodes are disposed along and in electrical contact with the primary electrodes. The secondary electrodes extend along the trace substantially parallel with the primary electrodes and form secondary electrical pathways adjacent the primary electrical pathways. The secondary electrodes are formed of a secondary conductor that is electrically conductive and has a higher strain limit than the primary electrodes. The secondary electrodes are able to handle a higher amount of strain than the primary electrode without breaking the secondary electrical pathway and thereby are arranged to complete the electrical circuits when a gap in a primary electrode interrupts the electrical circuit through the primary electrode.



PACKAGE INTEGRATED SYNTHETIC JET DEVICE

Thu, 06 Apr 2017 08:00:00 EDT

Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.



Electrostatic Chuck

Thu, 06 Apr 2017 08:00:00 EDT

In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of protrusions extending to a height above portions of the surface layer surrounding the protrusions to support the substrate upon the protrusions during electrostatic clamping of the substrate. The protrusions are substantially equally spaced across the surface layer as measured by a center to center distance between pairs of neighboring protrusions.



ELECTROSTATIC CHUCK WITH THERMAL CHOKE

Thu, 06 Apr 2017 08:00:00 EDT

Apparatuses, systems, and techniques for providing enhanced electrostatic chucks are provided. Such apparatuses, systems, and techniques may include, for example, a common RF and DC electrode in an electrostatic chuck, connection, at a location external to a semiconductor processing chamber, of a high-voltage DC power source and a high-voltage RF power source to a common conductive pathway leading to an electrostatic chuck in the interior of the semiconductor processing chamber, a very thin dielectric layer located on an upper surface of an electrostatic chuck, and/or an axial thermal choke that may be used to control heat flow within an electrostatic chuck.



ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME

Thu, 06 Apr 2017 08:00:00 EDT

Disclosed is an electrolytic capacitor including: an anode body; a dielectric layer formed over the anode body; a first conductive polymeric layer covering at least one portion of the dielectric layer; a second conductive polymeric layer covering at least one portion of the first conductive polymeric layer; and an intermediate layer formed between the first conductive polymeric layer and the second conductive polymeric layer. The intermediate layer includes a cation agent containing at least one cationic group, and an anion agent containing at least one first anionic group and at least one second anionic group, and the first anionic group is higher in electron-withdrawing property than the second anionic group. The anion agent includes a polymer containing the first anionic group and the second anionic group.



Methods for Forming Electrically Precise Capacitors, and Structures Formed Therefrom

Thu, 06 Apr 2017 08:00:00 EDT

High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.



CRYSTAL UNIT AND METHOD OF ADJUSTING CRYSTAL UNIT

Thu, 06 Apr 2017 08:00:00 EDT

A crystal unit includes: a capacitor in which a plurality of dielectrics and a plurality of internal electrodes are alternately stacked; a crystal piece arranged above the capacitor and having excitation electrodes on both surfaces thereof; an external electrode formed on a surface of the capacitor; and a first conductor portion formed within the capacitor, and including one end electrically coupled to a first internal electrode among the plurality of internal electrodes, the other end electrically coupled to the external electrode, and a first exposed portion exposed on the surface of the capacitor between the one end and the other end.



ELECTRONIC COMPONENT

Thu, 06 Apr 2017 08:00:00 EDT

An electronic component includes an element body having a pair of end surfaces opposing each other and a side surface adjacent to the pair of end surfaces, and an external electrode disposed on at least the end surface. The external electrode includes a conductive resin layer located on at least the end surface. A first thickness of the conductive resin layer located on a central region of the end surface is greater than a second thickness of the conductive resin layer located on a peripheral region of the end surface.



ELECTRONIC COMPONENT

Thu, 06 Apr 2017 08:00:00 EDT

An external electrode includes a sintered metal layer disposed on at least an end surface and a conductive resin layer disposed on the sintered metal layer. The sintered metal layer includes a first portion, a second portion, and a third portion. The first portion is disposed at a central region of the end surface. The second portion is disposed at a part of a peripheral region of the end surface, and extends to an edge portion of the end surface from the first portion. The third portion is disposed at a remaining part of the peripheral region of the end surface. The thickness of the second portion is less than that of the first portion. The thickness of the third portion is less than that of the second portion. The first portion, the second portion, and the third portion are covered with the conductive resin layer.



MULTILAYER CAPACITOR WITH INTEGRATED BUSBAR

Thu, 06 Apr 2017 08:00:00 EDT

Embodiments are directed to obtaining a specification of at least one operational requirement for at least one capacitor, generating a design of the at least one capacitor to satisfy the at least one operational requirement, the design of the at least one capacitor comprising a plurality of layers and a first integrated busbar coupled to at least a portion of the layers, and based on the design, manufacturing the at least one capacitor by utilizing an additive manufacturing technique.



System for Isolating Power Conductors Using Folded Insulated Sheets

Thu, 06 Apr 2017 08:00:00 EDT

An improved electrical system may be provided by electrically isolating complex bus geometries by using one or more substantially flat and electrically insulating sheets. The sheet may have one or more fold lines which allow the sheet to fold in multiple directions and ways over varying configurations of power conductors. The sheet may fit within the constraints of preconfigured electrical system components without the need for redesigning such components. The sheet may have a dielectric strength per mil effective to isolate power conductors based on maximum charge and proximity of the power conductors.



DEVICE SANDWICH STRUCTURED COMPOSITE HOUSING

Thu, 06 Apr 2017 08:00:00 EDT

The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.



PROGRAMMABLE CONTROLLER

Thu, 06 Apr 2017 08:00:00 EDT

A programmable controller includes forward switching units and backward switching units. The forward switching units electrically disconnect forward communication wirings if a module is mounted on a slot connector, and electrically short-circuits the forward communication wirings if no module is mounted on the slot connector. The backward switching units electrically disconnect backward communication wirings if the module is mounted on the slot connector, and electrically short-circuits the backward communication wirings if no module is mounted on the slot connector.



LOCKING MECHANISM

Thu, 06 Apr 2017 08:00:00 EDT

A computing device is described. The computing device may include a first portion and a second portion separably connected to the first portion. A locking mechanism may be configured to lock the first portion to the second portion. The locking mechanism may include a locking receptacle connected to the first portion and a locking protrusion connected to the second portion. The locking receptacle may include a rotating lock and may have an aperture through which the locking protrusion is insertable. The computing device may include an actuator mechanically coupled to the locking mechanism and configured to unlock the first portion from the second portion.



ELECTRONIC APPARATUS

Thu, 06 Apr 2017 08:00:00 EDT

An electronic apparatus is disclosed. An electronic apparatus comprises a case, a panel, a display, and a supporting component. The panel includes a layer of sapphire located on a surface of the electronic apparatus. The display comprises a first surface including a display screen and a second surface opposite to the first surface. The supporting component is fixed to the case in the case and supports the display. The display is fixed to the panel in the first surface and fixed to the supporting component in the second surface.



Information Handling System Hinge and Flexible Cover

Thu, 06 Apr 2017 08:00:00 EDT

A portable information handling system has lid and main portions rotationally coupled to each other with a set of hinges having motion managed by rack and pinion gears. The rack translates motion between pinions by moving outward from the housing portions during rotation of the housing portions. A flexible cover over the rack stretches in response to movement of the rack to contain the hinges within the portable information handling system structure.



DISPLAY DEVICE AND DISPLAY SYSTEM

Thu, 06 Apr 2017 08:00:00 EDT

A display device in an embodiment according to the present invention includes a display region arranged above a flexible substrate, the display region including a first display region and a second display region continuing from the first display region, at least the second display region including a curved surface. The second display region is located at a position where an image displayed in the second display region is not seen directly when viewing the first display region from a perpendicular direction with respect to a center part of the first display region.



Rotatable platter for a monitor having a passage for wiring and a stopper

Thu, 06 Apr 2017 08:00:00 EDT

A rotatable platter for monitors comprising a platter member fixedly attached to a rotating plate member. The rotating plate member is connected, by way of an annular ball bearing member to a fixed plate member. An opening made through a center portion of the platter member allows for at least one cable to pass therethrough. The cable passes through a hollow opening forming part of the annular annular ball bearing. A peg engaging one of two possible channels controls the degree of allowable rotation of the platter member.



INTEGRATED INTRAVENOUS (IV) CLAMP AND POWER SUPPLY

Thu, 06 Apr 2017 08:00:00 EDT

An intravenous (IV) pole assembly includes a non-conductive support element, distribution rails respectively disposed along a length of the non-conductive support element and a clamping element. The distribution rails are respectively configured for power distribution along the length of the non-conductive support element. The clamping element includes a hinged clamp, which is attachable to the non-conductive support element at an attachment point defined along the length of the non-conductive support element, and a connector by which power is selectively transmittable from the distribution rails to a powered device supportable on the hinged clamp.