Tue, 10 May 2016 08:00:00 EDTAn electrostatic discharge (ESD) protection circuit is provided. The ESD protection circuit includes an impedance device coupled between a pad and a power line and a clamp unit coupled between the pad and a ground line.
Tue, 19 Apr 2016 08:00:00 EDTAn apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.
Tue, 20 Oct 2015 08:00:00 EDTAn electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.
Tue, 29 Sep 2015 08:00:00 EDTDisclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.
Tue, 25 Aug 2015 08:00:00 EDTThe present invention is directed to a circuit interrupting device including an actuator that provides an actuator stimulus upon the occurrence of the fault actuation signal. A circuit interrupter is positioned to electrically disconnect the first, second and third electrical conductors from each other upon the occurrence of the actuator stimulus. An automated test circuit is coupled to the circuit interrupting assembly. The automated test circuit is configured to automatically produce the simulated fault condition during a predetermined portion of an AC line cycle to determine whether the fault detection assembly is operational such that the fault detection assembly provides a fault detection signal without the circuit interrupter electrically disconnecting the first, second and third electrical conductors from each other. The automated test circuit is further configured to provide a device failure mode signal such that a plurality of the first, second or third electrical conductors are disconnected from each other if the fault detection signal is not detected within a predetermined time frame.
Tue, 11 Aug 2015 08:00:00 EDTA new type of portable USB mass storage gadget is disclosed which provides the user with upgradeable high speed mass storage and processing for use with portable computer appliances such as smart phones and tablets as well as standard desk top computers and laptops. Various modifications to the embodiment referred to as a UDRIVE are disclosed including a battery option, wireless connectivity, security, and additional internal electronics and external interfaces that allow processing of the data stored or sent to the portable gadget.
Tue, 28 Jul 2015 08:00:00 EDTA circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.
Tue, 21 Jul 2015 08:00:00 EDTSystems are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.
Tue, 07 Jul 2015 08:00:00 EDTThe electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2
Tue, 09 Jun 2015 08:00:00 EDTA system for performing computing operations includes a rack, one or more shelves coupled to the rack, and two or more computing modules. Each computing module may include a chassis, one or more circuit board assemblies in a primarily vertical orientation, and one or more hard disk drives in a primarily vertical orientation. The circuit board assemblies and the hard disk drives are coupled to the chassis of the computing module.
Tue, 09 Jun 2015 08:00:00 EDTA capacitor includes: an anode part that is drawn from an anode body of a capacitor element to an element end-face, to be formed over the element end-face; a cathode part that is drawn from a cathode body of the capacitor element to the element end-face, to be formed over the element end-face; an anode terminal member that is disposed in a sealing member; a cathode terminal member that is disposed in the sealing member; an anode current collector plate that is connected to the anode part, and is also connected to the anode terminal member; and a cathode current collector plate that is connected to the cathode part, and is also connected to the cathode terminal member.
Tue, 02 Jun 2015 08:00:00 EDTA housing for an electronic circuit for a fuel pump includes a base and a cover which is connected to the base, a printed circuit board and, disposed on one side of the latter, electric and/or electronic components. Disposed on either side of the printed circuit board in each case is a cover in such a way that each component is arranged in a region covered by a cover.
Tue, 26 May 2015 08:00:00 EDTAn arc detection and intervention system for a solar energy system. One or more arc detectors are strategically located among strings of solar panels. In conjunction with local management units (LMUs), arcs can be isolated and affected panels disconnected from the solar energy system.
Tue, 26 May 2015 08:00:00 EDTCooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
Tue, 26 May 2015 08:00:00 EDTIn one embodiment, the system comprises: (a) a chassis; (b) one or more cards mounted in the chassis, each card having a plurality of switch ports, the plurality of switch ports being aligned in one or more columns; (c) an aggregator mounted adjacent the chassis, the aggregator having a plurality of bays, each bay being aligned with a card in the chassis, at least one of the bays having a faceplate comprising at least first and second aggregator ports aligned in a column; (d) at least first and second hydras, wherein each hydra comprises at least (i) a first connector; (ii) a plurality of second connectors; (iii) a plurality of conductors, each conductor connecting the first connector to one of the second connectors, the plurality of conductors being bundled together to form a trunk portion from the first connector to a breakout point, the plurality of conductors being separated into breakout portions from the breakout point to the second connectors; (iv) wherein the trunk portion of the first cable is longer than that of the second cable; and (e) wherein the first connector of the first hydra is connected to the first aggregator port and the second connectors of the first hydra are connected to a first set of switch ports, and the first connector of the second hydra is connected to the second aggregator port and the second connectors of the second hydra are connected to a second set of switch ports, wherein the first set of switch ports are further away from the aggregator than the second set of switch ports.
Tue, 26 May 2015 08:00:00 EDTA silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.
Tue, 26 May 2015 08:00:00 EDTA power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.
Tue, 26 May 2015 08:00:00 EDTAn apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
Tue, 26 May 2015 08:00:00 EDTA lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
Tue, 26 May 2015 08:00:00 EDTAccording to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member.
Tue, 26 May 2015 08:00:00 EDTA semiconductor device effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.
Tue, 26 May 2015 08:00:00 EDTA printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad and defines at least one via under the at least one first signal pad. The daughterboard includes at least one second signal pad and defines at least one via under the at least one second signal pad. The at least one first signal pad and the at least one second signal pad are sucked into the respective vias on the motherboard and the daughterboard according to siphon principle to allow each of the first signal pads and the second signal pads to form uneven top surfaces, the uneven top surfaces of the at least one first signal pads and the at least one second signal pads are connected to each other for electronically connecting the daughterboard to the motherboard.
Tue, 26 May 2015 08:00:00 EDTAn apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
Tue, 26 May 2015 08:00:00 EDTAn electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.
Tue, 26 May 2015 08:00:00 EDTDisclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.
Tue, 26 May 2015 08:00:00 EDTA converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.
Tue, 26 May 2015 08:00:00 EDTA system for securing an access opening of a cable raceway using a single padlock includes a cover having a securing wall and opposed first and second sidewalls, which form a channel for accommodating at least a portion of the cable raceway with the securing wall covering the access opening. First and second insert bars engage the first and second sidewalls and a lock bar engages the first and second insert bars and may be locked in an engaged position to prevent the first and second insert bars from being disengaged with the cover and to secure the cover about the cable raceway preventing access to the access opening.
Tue, 26 May 2015 08:00:00 EDTA positioning structure for a removable hard drive includes an enclosure and a tray. The enclosure is used for being mounted by the hard drive, and disposed with a plurality of positioning holes. The tray includes a bottom and two side walls vertically extending therefrom. A space being is formed by the bottom and the side walls. The bottom is formed with a plurality of positioning pillars corresponding to the positioning holes. The enclosure is received in the space, and the positioning holes are correspondingly inserted by the positioning pillars.
Tue, 26 May 2015 08:00:00 EDTA mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing 12 and a lower housing 22 coupled in a freely slidable manner are electrically connected to each other by a flexible printed circuit board folded back to be routed between slide facing surfaces 12b and 22a of both the housings and the height of a side wall surface 12c and 22c of the upper housing and lower housing changes in a bending manner along the direction of freely sliding and, in the slide facing surfaces of the upper housing and lower housing, concave space portions 15 and 25 to accommodate the change in curvature and in position of a folding-back portion 31a caused by sliding motion between the upper housing and lower housing are disposed.
Tue, 26 May 2015 08:00:00 EDTIn a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.
Tue, 26 May 2015 08:00:00 EDTDisclosed herein is a display device including a main board part configured to have a display area including drive wiring and have a display panel disposed in the display area; and an auxiliary board part configured to be monolithic with the main board part and have extraction wiring from the drive wiring.
Tue, 26 May 2015 08:00:00 EDTDisclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
Tue, 26 May 2015 08:00:00 EDTAn electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.
Tue, 26 May 2015 08:00:00 EDTA portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.
Tue, 26 May 2015 08:00:00 EDTA power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals.
Tue, 26 May 2015 08:00:00 EDTA waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.
Tue, 26 May 2015 08:00:00 EDTAn electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
Tue, 26 May 2015 08:00:00 EDTAn assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
Tue, 26 May 2015 08:00:00 EDTA method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
Tue, 26 May 2015 08:00:00 EDTA cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
Tue, 26 May 2015 08:00:00 EDTAn electronic component assembly includes a housing that provides a cavity filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element is arranged in the cavity and is configured to generate heat. A wicking material is arranged in the cavity between the housing and the electronic device. The cavity provides a gap adjacent to the wicking material. The wicking material is configured to absorb the liquid phase, and the vapor phase is provided in the gap.
Tue, 26 May 2015 08:00:00 EDTDisclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
Tue, 26 May 2015 08:00:00 EDTA mobile terminal has a waterproof sheet interposed between a first body portion and a second body portion. The waterproof sheet is formed with a curved shaped or step-like cross-section in consideration of characteristic of internal component or a battery arranged on the first body portion of the mobile terminal, the curved shaped or step-like cross-section is configured to encase, in part or in whole, the internal component or the battery.
Tue, 26 May 2015 08:00:00 EDTAn insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.
Tue, 26 May 2015 08:00:00 EDTA mounting apparatus for a solid state disk includes a bracket and a latching module. The bracket includes a connecting pole and a supporting member mounted to the connecting pole. The latching module is installed to the supporting member, and comprises a latching member. The supporting member includes a position pole mounted to the connecting pole and a supporting bar perpendicularly extending out from the position pole. The position pole defines a latching slot facing the supporting bar for positioning an end of the solid state disk. The supporting bar defines a guiding slot facing the latching slot for receiving a side of the solid state disk. The latching member is to latch onto the solid state disk.
Tue, 26 May 2015 08:00:00 EDTA monitor fixing mechanism for fixing a monitor is disclosed. The monitor fixing structure includes a pivot plate and a support member. The pivot plate is detachably connected to the support plate so as to pivot the monitor relative to a stand. The support member includes a plate, at least one lateral guiding structure disposed on the plate for laterally constraining movement of the pivot plate as the pivot plate is sliding into the plate in a first direction, and at least one stopping structure disposed on the plate for stopping an end of the pivot plate as the pivot plate has slid into the plate in the first direction completely. The monitor fixing mechanism further includes a fastening module for fastening the pivot plate on the support member as the pivot plate has slid into the plate in the first direction completely.
Tue, 26 May 2015 08:00:00 EDTportable electronic device includes a host module, a display module and a hinge structure. The hinge structure is pivotally connected to the host module and the display module. The hinge structure includes a support frame, a rotating component and two pivotal components. An end of the rotating component is installed inside the support frame and another end of the rotating component is installed inside the display module, so that the display module is capable of rotating in a first rotating direction relative to the support frame. The two pivotal components are disposed at opposite sides of the support frame and separated from the rotating component. An end of each pivotal component is installed inside the support frame and another end of each pivotal component is installed inside the host module, so that the display module is capable of rotating in a second rotating direction relative to the host module.
Tue, 26 May 2015 08:00:00 EDTA mounting apparatus includes a supporting board, a first adjusting member including a rotating board and a fixing plate, a second adjusting member to install a display device. The rotating board includes a tab, is mounted on the supporting board, and is rotatable about an axis perpendicular to the supporting board. The second adjusting member is mounted to the fixing plate and is rotatable about an axis perpendicular to the fixing plate. A first sliding block is slidably mounted to the supporting board. A second sliding block is slidably mounted to the rotating plate. The first and second sliding blocks each define a slanted groove. A pin protrudes from each of the tab and the second adjusting member to be slidably received in the slanted grooves. The first sliding block is slid to rotate the first adjusting member, the second sliding blocks is slid to rotate the second adjusting members.
Tue, 26 May 2015 08:00:00 EDTA hinge assembly having a hollow and partially annular clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least an elongated, hollow and partially open cylindrical portion that includes a partially annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow and partially open cylindrical portion such that space, size and part count are minimized.
Tue, 26 May 2015 08:00:00 EDTAccording to one embodiment, a battery-mounting structure includes a first housing, a second housing including a display device including a display screen, a hinge configured to attach the second housing to the first housing rotatably between a first position in which the display screen is covered with the first housing and a second position in which the display screen is exposed, and a battery configured to be attached to the first housing and including a recess configured to accommodate a part of the second housing in the second position.